HPE Intel Xeon-Gold 6256 processor 3.6 GHz 33 MB L3 Tray
Special Price
£4,678.95
£5,614.74
Regular Price
£8,137.30
£9,764.76
Out of stock
SKU
P27657-B22
HPE Intel Xeon-Gold 6256, Intel® Xeon® Gold, LGA 3647 (Socket P), 14 nm, Tray, Intel, 3.6 GHz
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Box | No |
| Processor cores | 12 |
| Processor family | Intel Xeon Gold |
| SKU | P27657-B22 |
| EAN | 0190017450834 |
| Manufacturer | HPE |
| Availability | N |
HPE Intel Xeon-Gold 6256. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1.02 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 33 MB |
| Processor model | 6256 |
| Processor threads | 24 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 12 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
|---|---|
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |
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