Skip to the beginning of the images gallery

Kingston Technology FURY Beast 16GB 6000MT/s DDR5 CL36 DIMM (Kit of 2) Black EXPO

Be the first to review this product

Special Price £47.15 £56.58 Regular Price £78.58 £94.30

4 In stock

SKU

KF560C36BBEK2-16

16GB 6000MT/s DDR5 CL36 DIMM (Kit of 2) FURY Beast Black EXPO

Improved stability for overclocking
Increased efficiency
Intel® XMP 3.0 Certified
AMD EXPO™ Certified
Qualified by the world’s leading motherboard manufacturers*
Low-profile heat spreader design in black or white

More Information

More Information
Internal memory type	DDR5
Memory clock speed	3000 MHz
ECC	No
Memory form factor	288-pin DIMM
SKU	KF560C36BBEK2-16
EAN	0740617331721
Manufacturer	Kingston Technology
Availability	Y
Product Family	FURY
Product Series	Beast
Product Videos	View Video
PDF URLs	View PDF

Description

Kingston FURY™ Beast DDR5 memory brings the latest, cutting-edge technology for next-gen gaming platforms. Taking speed, capacity and reliability even further, DDR5 arrives with an arsenal of enhanced features, like on-die ECC (ODECC) for improved stability at extreme speeds, dual 32-bit subchannels for increased efficiency and an on-module power management integrated circuit (PMIC) to provide juice where it’s needed most.

Superior speed advancements with double the banks from 16 to 32 and double the burst length from 8 to 16 take DDR5 memory, your gaming experience and your overall system applications to the next level of performance.

Whether you’re pushing the limits in your gaming with the most extreme settings, live streaming at 4K+ or pushing large animations and 3D rendering, Kingston FURY Beast DDR5 memory is the level-up you need, while seamlessly bridging style and unleashing performance.

With options featuring Intel® XMP 3.0 and AMD EXPO™, two new DDR5 overclock specs that include customisable profiles for speeds and timings, Kingston FURY Beast DDR5 has your compatible overclock solutions covered.

Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!

Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.

Intel® XMP 3.0 certified
Advanced pre-optimized timings, speed and voltage for overclocking performance and save new user-customizable profiles utilizing a programmable PMIC.

AMD EXPO certified
AMD’s Extended Profiles for Overclocking

Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.

Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.

Specifications

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Memory clock speed	3000 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Memory clock speed	3000 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s

Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Width	6.62 mm
Depth	133.3 mm
Height	34.9 mm
Weight	66.08 g
Package weight	101.72 g
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	101.72 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.75 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan